Foxconn Demonstrates Compact 25G Transceivers at OFC 2016
Foxconn Interconnect Technology demonstrated its latest optical transceiver technologies for next generation data center and enterprise storage applications at OFC 2016.
Demonstration Highlights
- Extended-reach 100G QSFP28 eSR4 transceivers operating over 300m MMF
- 300G CXP2 SR12 pluggable transceiver operating with next generation embedded transceiver at 28 Gb/s per lane
- Compact 25G SR SFP-like transceiver with LC duplex MMF interface operating at 25 Gb/s
- 100G QSFP28 CWDM4 transceiver operating at 25 Gb/s per lane
- Long reach 32G Fibre Channel SFP28 transceiver operating at 28 Gb/s
“The transition to higher Ethernet and Fibre Channel speeds in the data center and enterprise storage networks will drive the need for new optical transceiver solutions with new signaling formats and form factors to address the power and reach requirements. Combining world-class fiber optic interconnect technologies with deep expertise in high-speed transceiver subsystems, FIT has developed a new set of advanced optical transceivers in support of next generation systems and demonstrated its continued commitment to addressing the growing data center market,” said Philip Gadd, Vice President and General Manager of Foxconn Interconnect Technology, Limited.
About Foxconn Interconnect Technology, Limited
Foxconn Interconnect Technology, Limited focuses on the development, manufacturing and marketing of electronic and optoelectronic connectors, antennas, acoustic components, cables and modules for applications in computers, communication equipment, consumer electronics, automobiles, industrial and green energy field products. With offices and manufacturing sites located in Asia, the Americas and Europe, FIT is a global leader in the manufacturing of high precision interconnect components.
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